Senior Signal Integrity / Power Integrity (SI/PI) Engineer

Who You'll Work With

Arista’s cutting-edge Ethernet and optical networking platforms are built to push the limits of performance, density, and power efficiency. This wouldn’t be possible without our Signal Integrity (SI) and Power Integrity (PI) engineers who design, simulate, and characterize interconnects enabling the fastest SerDes technologies in the industry. We’re looking for a Senior Signal Integrity / Power Integrity Hardware Engineer to join our Hardware Design team at our headquarters in Santa Clara, CA. In this role, you’ll work at the intersection of advanced simulation, next-generation SerDes (112G/224G/448G PAM4), and innovative routing, packaging, and power delivery techniques. Your work will directly influence the architecture and layout of Arista’s next-generation Ethernet and optical systems for hyperscale, AI, and cloud networking.

The total estimated annual compensation range for this position, inclusive of base salary, bonus, and equity, is $300,000 to $655,000. This range is a good faith estimate only. Bonus and equity are discretionary, subject to plan terms, and are not guaranteed components of total compensation. Actual total annual compensation may vary based on employee performance, company or equity performance, company policy, board approval, or similar factors. Please see additional base salary information below.

What You'll Do

• Perform 3D EM design and simulation of high-speed interconnects (channels, vias, packages, and connectors) for 112G/224G PAM4 SerDes using tools such as Ansys HFSS, SiWave, and Cadence Sigrity.

• Develop and validate test vehicles to characterize next-generation PCB materials, packages, and interconnects.

• Conduct S-parameter and time-domain measurements (VNA, TDR, BERT) to extract channel performance and validate modeling correlation.

• Perform link-level analysis for advanced standards (Ethernet 800G/1.6T, PCIe Gen6/Gen7, CXL) using tools such as Keysight ADS or Cadence SystemSI.

• Collaborate closely with hardware, mechanical, and packaging teams to optimize stack- up, breakout, and routing strategies for high-density designs.

• Research and prototype novel materials, backplane concepts, and low-loss interconnect topologies to meet next-generation performance targets.

• Support bring-up and debug of production boards, working cross-functionally to root-cause SI/PI issues.